Air cooling, Water cooling HEAT SINKS, Heat pipe Exchangers & laminated busbars

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Air cooling, Water cooling HEAT SINKS, Heat pipe Exchangers & laminated busbars

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Air cooling, Water cooling HEAT SINKS, Heat pipe Exchangers & laminated busbars

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Features
Heat pipe Exchangers, Cooling plates for press pack and IGBT devices, Thermal resistance, <20 C / KW under air cooling, <10 C / KW under water cooling, Reduced weight, and space with special grid plates, Heat pipe with & without Isolation for high power devices.

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